Effect of SAC105 Solder Alloys High Strain Rate Property Evolution on Plastic Work at Low Operating Temperatures
Author:
Affiliation:
1. Auburn University NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849
2. US Army CCDC-AvMC,Huntsville,AL,35898
Funder
Auburn University
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899520.pdf?arnumber=9899520
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4. Modeling Constitutive Model Effect on Reliability of Lead-Free Solder Joints
5. High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics
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