Author:
Lall Pradeep,Panchagade Dhananjay,Iyengar Deepti,Shantaram Sandeep,Suhling Jeff,Schrier Hubert
Cited by
25 articles.
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1. Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges;Microelectronics Reliability;2022-12
2. Effect of SAC105 Solder Alloys High Strain Rate Property Evolution on Plastic Work at Low Operating Temperatures;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
3. Reliability of MEMS in Shock Environments: 2000–2020;Micromachines;2021-10-20
4. Non-Perpendicular High-G Shock on Potted Fine Pitch Electronics Under Sustained High Temperature Aging;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01
5. Failure of MEMS Microphones During Impact Tests: the Role of Anchor Imposed Motion;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19