A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing
Author:
Affiliation:
1. Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, TX, USA
Funder
Texas Instruments to the University of Texas at Dallas
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/6287639/9668973/09852453.pdf?arnumber=9852453
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