Microelectronics packaging technology roadmaps, assembly reliability, and prognostics
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National Library of Serbia
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
2. Comparison of electroless plating interconnection of different reducing agent systems;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Effect of additives on uniformity of copper coatings at electroless plating interconnection;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
4. Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study;Micromachines;2023-06-15
5. Distortion of an LTCC Bilayer during Constrained Sintering: Comparison between Ombroscopic Imaging and Modeling;Materials;2022-09-15
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