Effect of additives on uniformity of copper coatings at electroless plating interconnection
Author:
Affiliation:
1. Central South University,College of Mechanical and Electrical Engineering,Changsha,China
Funder
National Natural Science Foundation of China
Natural Science Foundation of Hunan Province
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492051.pdf?arnumber=10492051
Reference10 articles.
1. Microelectronics packaging technology roadmaps, assembly reliability, and prognostics
2. Copper pillar bump technology progress overview
3. An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
4. Bumpless Interconnect Through Ultrafine Cu Electrodes by Means of Surface-Activated Bonding (SAB) Method
5. Low-Temperature Bonding of Copper Pillars for All-Copper Chip-to-Substrate Interconnections
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