Using BP network for ultrasonic inspection of flip chip solder joints

Author:

Su Lei,Zha Zheyu,Lu Xiangning,Shi Tielin,Liao Guanglan

Publisher

Elsevier BV

Subject

Computer Science Applications,Mechanical Engineering,Aerospace Engineering,Civil and Structural Engineering,Signal Processing,Control and Systems Engineering

Reference21 articles.

1. Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy;Brand;Microelectron. Reliab.,2010

2. Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application;Tan;Opt. Lasers Eng.,2008

3. Composite lead-free electronic solders;Guo;J. Mater. Sci.: Mater. Electron.,2007

4. Neural networks based on AOI systems for electronic devices diagnosis;Lera;Proc. SPIE,2003

5. A.N. Belbachir, M. Lera, A. Fanni, A. Montisci, An automatic optical inspection system for the diagnosis of printed circuits based on neural networks, in: Proceedings of the 40th Annual Meeting of the IEEE Industry Applications Society, vol. 1–4, 2005, pp. 680–684.

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