An improved orthogonal matching pursuit method for denoising high-frequency ultrasonic detection signals of flip chips-Reference-Cited by-同舟云学术

An improved orthogonal matching pursuit method for denoising high-frequency ultrasonic detection signals of flip chips

Published:2023-04 Issue: Volume:188 Page:110030
ISSN:0888-3270
Container-title:Mechanical Systems and Signal Processing
language:en
Short-container-title:Mechanical Systems and Signal Processing

Author:

Su Lei,Tan Shihong,Qi Yang,Gu Jiefei,Ji Yong,Wang Gang,Ming Xuefei,Li Ke,Pecht Michael

Publisher

Elsevier BV

Subject

Computer Science Applications,Mechanical Engineering,Aerospace Engineering,Civil and Structural Engineering,Signal Processing,Control and Systems Engineering

Reference42 articles.

1. Defect inspection of flip chip solder joints based on non-destructive methods: a review;Su;Microelectron. Reliab.,2020

2. Automated X-ray recognition of solder bump defects based on ensemble-ELM;Su;Sci. China-Technol. Sci.,2019

3. Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF;Su;Mech. Syst. Sig. Process.,2017

4. Electronic circuit health estimation through kernel learning;Vasan;IEEE T. Ind. Electron.,2018

5. Using BP network for ultrasonic inspection of flip chip solder joints;Su;Mech. Syst. Sig. Process.,2013

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