Author:
Brand S.,Czurratis P.,Hoffrogge P.,Petzold M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. Advances in acoustic microscopy;Briggs,1995
2. Omathuna SC, Fromont T, Koschnick W, Oconnor L. Test chips, test systems, and thermal test data for multichip modules in the Esprit-Apachip Project; 1994.
3. Channel defect detection in food packages using integrated backscatter ultrasound imaging;Raum;IEEE Trans Ultrason Ferro Freq Control,1998
4. Reichl H. Packaging aspects of single and multichip modules. In: Proceedings of the 1st European conference on electronic packaging technology (EuPac 1994). German Welding Society; 1994. p. 6–9.
5. An introduction to die attach;White;Weld Inst Res Bull,1981
Cited by
40 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献