Test chips, test systems, and thermal test data for multichip modules in the ESPRIT-APACHIP project-Reference-Cited by-同舟云学术

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Test chips, test systems, and thermal test data for multichip modules in the ESPRIT-APACHIP project

Published:1994 Issue:3 Volume:17 Page:425-435
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

O'Mathuna S.C.,Fromont T.,Koschnick W.,O'Connor L.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/7559/00311752.pdf?arnumber=311752

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-cost and versatile thermal test chip for power assemblies assessment and thermometric calibration purposes;Applied Thermal Engineering;2011-07

2. Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy;Microelectronics Reliability;2010-09

3. Controlled on-chip heat transfer for directed heating and temperature reduction;Solid-State Electronics;2009-06

4. Effect of Gold Stud Bump Topology on Reliability of Flip Chip on Flex Interconnects;IEEE Transactions on Advanced Packaging;2007-11

5. Characterizing stress in ultrathin silicon wafers;Applied Physics Letters;2006-08-14

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