Author:
Jordà X.,Perpiñà X.,Vellvehi M.,Madrid F.,Flores D.,Hidalgo S.,Millán J.
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference30 articles.
1. Integrated test chips improve IC assembly;Sweet;IEEE Circuits and Devices Magazine,1990
2. Evaluation of a plastic encapsulated package using a scalable thermal mechanical test chip;Hullinger,1995
3. Thermal chip evaluation of IC packaging;McLaughlin;IEEE Transactions on Parts, Hybrids and Packaging,1972
4. The increasing importance of thermal test dies;Rencz;Electronics Cooling,2000
5. Thermal resistance measurement protocols;O’Flaherty;Microelectronics Journal,1998
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献