Thermal Chip Evaluation of IC Packaging-Reference-Cited by-同舟云学术

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Thermal Chip Evaluation of IC Packaging

Published:1972-09 Issue:3 Volume:8 Page:39-44
ISSN:0361-1000
Container-title:IEEE Transactions on Parts, Hybrids, and Packaging
language:en
Short-container-title:IEEE Trans. Parts, Hybrids, Packag.

Author:

McLaughlin M.,Fitzroy N.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx6/8217/25354/01136572.pdf?arnumber=1136572

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-cost and versatile thermal test chip for power assemblies assessment and thermometric calibration purposes;Applied Thermal Engineering;2011-07

2. Calibration of resistance type die level temperature sensors using a single temperature technique;IEEE Transactions on Components and Packaging Technologies;2000-03

3. Thermal Studies of a Plastic Dual-in-Line Package;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1979-12

4. High Temperature Thermal Characteristics of Microelectronic Packages;IEEE Transactions on Parts, Hybrids, and Packaging;1977-12

5. Packaging;Semiconducting Devices;1976

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