Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
8 articles.
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1. Thermal simulation of semiconductor ICs: general and practical approach;Microelectronics Journal;1997-03
2. Thermal conductivity of molding compounds for plastic packaging;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A;1994
3. High-performance power package for power-integrated circuit devices;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1989
4. Thermal analysis of a dual-in-line package using the finite-element method;IEE Proceedings I Solid State and Electron Devices;1987
5. Bibliography of Heat Transfer in Electronic Equipment;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1985-06