Thermal simulation of semiconductor ICs: general and practical approach-Reference-Cited by-同舟云学术

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Thermal simulation of semiconductor ICs: general and practical approach

Published:1997-03 Issue:3 Volume:28 Page:221-227
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Koval Vladimir A.,Fedasyuk Dmytro V.

Publisher

Elsevier BV

Subject

General Engineering

Reference4 articles.

1. CAD: the numerical and analytical methods combined for the analysis of IC's thermal fields;Koval,1993

2. Thermal studies of a plastic dual-in-line package;Mitchell;IEEE Trans. Components, Hybrids, Manufacturing Technol.,1979

3. Thermal resistance: a reliability consideration;Manchester;IEEE Trans. Components, Hybrids, Manufacturing Technol.,1989

4. Multilevel thermal simulation of MCM's by System ‘MONSTR-M’;Koval,1995

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Static and dynamic finite element modelling of thermal fatigue effects in insulated gate bipolar transistor modules;Microelectronics Reliability;2000-03

2. Thermal modeling of microelectronic equipment taking into account thermal contact conductance;The Experience of Designing and Application of CAD Systems in Microelectronics, 2003. CADSM 2003. Proceedings of the 7th International Conference.

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