Author:
Dilli Zeynep,Akturk Akin,Goldsman Neil,Metze George
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. Gelsinger P. Microprocessors for the new millenium: challenges, opportunities, and new frontiers. In: International solid-state circuits conference (ISSCC) digest of technical papers, San Fransisco; 2001. p. 22–5.
2. Coming challenges in microarchitecture and architecture;Ronen;Proc IEEE,2001
3. Mixed-mode temperature modeling of full-chip based on individual non-isothermal device operations;Akturk;Solid-State Electron,2005
4. Self-consistent modeling of heating and mosfet performance in three-dimensional integrated circuits;Akturk;IEEE Trans Electron Dev,2005
5. Im S, Banerjee K. Full chip thermal analysis of planar (2D) and vertically stacked integrated (3D) high performance ICs. In: Technical Digest of IEDM’00, San Fransisco; 2000. p. 727–30.
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