Volumetric nondestructive metrology for 3D semiconductor packaging: A review
Author:
Funder
National Institute of Standards and Technology
Publisher
Elsevier BV
Subject
Applied Mathematics,Electrical and Electronic Engineering,Condensed Matter Physics,Instrumentation
Reference152 articles.
1. 3D packaging for heterogeneous integration;Agarwal,2022
2. Hyperspectral time-domain terahertz nano-imaging;Aghamiri;Optics Express,2019
3. A review on echo and phase inverted scanning in acoustic microscopy for failure analysis;Ahmad;Przegląd Elektrotechniczny,2021
4. AI-powered terahertz VLSI testing technology for ensuring hardware security and reliability;Akter;IEEE Access,2021
5. Impact of X-ray tomography on the reliability of integrated circuits;Alam;IEEE Transactions on Device and Materials Reliability,2017
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Nondestructive testing of chips faults based on Terahertz pulse time-domain reflection technology;Physics Letters A;2024-11
2. Fast in-line failure analysis of sub-micron-sized cracks in 3D interconnect technologies utilizing acoustic interferometry;Communications Engineering;2024-07-19
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3