Affiliation:
1. Department of Electrical Engineering, Pohang University of Science and Technology, Pohang, South Korea
Funder
Samsung Electronics Corporation Ltd.
Institute of Information and Communications Technology Planning and Evaluation (IITP) Grant funded through the Korean Government
“Investigation on Future mm-Wave Circuits, Packages, and System”
“Development of 300-GHz Band Tbps Beamforming Transceiver Chip for Next-Generation Short-Range Communication”
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献