Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing-Reference-Cited by-同舟云学术

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing

Published:2021-10 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE International 3D Systems Integration Conference (3DIC)
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Author:

Fukushima Takafumi¹,Sakuyama Shinichi²,Takahashi Masatomo³,Hashimoto Hiroyuki¹,Bea Jichoel¹,Marcello Theodorus⁴,Kino Hisashi⁵,Tanaka Tetsu⁶,Koyanagi Mitsumasa¹,Mariappan Murugesan¹

Affiliation:

1. Global INTegration Initiative (GINTI), New Industry Creation Hatchery Center (NICHe), Tohoku University,Sendai,Japan

2. Prober System Group, Tokyo Seimitsu Co., Ltd.,Tokyo,Japan

3. Tokyo Seimitsu Co., Ltd.,Strategic Planning Dept.,Tokyo,Japan

4. AntaputraSchool of Engineering, Tohoku University,Sendai,Japan

5. Frontier Research Institute for Interdisciplinary Sciences (FRIS), Tohoku University,Sendai,Japan

6. Graduate School of Biomedical Engineering, Tohoku University,Sendai,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9687597/9687598/09687601.pdf?arnumber=9687601

Reference7 articles.

1. On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO 2

2. Development of via-last 3D integration technologies using a new temporary adhesive system

3. MEMS Vertical Probe Cards With Ultra Densely Arrayed Metal Probes for Wafer-Level IC Testing

4. 500 nm-sized Ni-TSVwith Aspect Ratio 20 for Future 3D-LSIs_A Low-Cost Electroless-Ni Plating Approach

5. MEMS probes for on-wafer RF microwave characterization of future microelectronics: design, fabrication and characterization

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