On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO 2-Reference-Cited by-同舟云学术

On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO 2

Published:2020-07-08 Issue:16 Volume:58 Page:2248-2258
ISSN:2642-4150
Container-title:Journal of Polymer Science
language:en
Short-container-title:Journal of Polymer Science

Author:

Fukushima Takafumi¹²³^ORCID,Murugesan Mariappan²,Bea Ji‐Cheol²,Hashimoto Hiroyuki²,Kino Hisashi⁴,Tanaka Tetsu¹³,Koyanagi Mitsumasa²

Affiliation:

1. Department of Mechanical Systems Engineering, Graduate School of EngineeringTohoku University Sendai Miyagi Japan

2. Global INTegration Initiative (GINTI), New Industry Creation Hatchery Center (NICHe), Tohoku University Sendai Miyagi Japan

3. Department of Biomedical Engineering, Graduate School of Biomedical EngineeringTohoku University Sendai Miyagi Japan

4. Frontier Research Institute for Interdisciplinary Sciences, Tohoku University Sendai Miyagi Japan

Funder

JSPS KAKENHI (Multi-year Fund), Grant-in-Aid for Challenging Exploratory Research

JSPS KAKENHI, Fund for the Promotion of Joint International Research (Fostering Joint International Research

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pol.20200094

Reference35 articles.

1. Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

2. High-Density Through Silicon Vias for 3-D LSIs

3. Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration

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