Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited)
Author:
Affiliation:
1. Siemens EDA,Yerevan,Armenia
2. Siemens EDA,Fremont,CA,USA
3. University of Minnesota,Dept. of ECE,Minneapolis,MN,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9764406/9764408/09764415.pdf?arnumber=9764415
Reference21 articles.
1. Electromigration Effects in Power Grids Characterized From a 65 nm Test Chip
2. Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects
3. General model for mechanical stress evolution during electromigration
4. A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure
5. Free Energy of a Nonuniform System. I. Interfacial Free Energy
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution;Proceedings of the 2023 International Symposium on Physical Design;2023-03-26
2. Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03
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