Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution
Author:
Affiliation:
1. Siemens EDA, Yerevan, Armenia
2. Siemens EDA, Fremont, CA, USA
3. University of Toronto, Tonto, ON, Canada
4. University of Minnesota, Minneapolis, MN, USA
5. CEA LETI, Grenoble, France
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3569052.3578922
Reference11 articles.
1. Power Grid Fixing for Electromigration-induced Voltage Failures
2. Power grid electromigration checking using physics-based models;Chatterjee S.;IEEE Trans. Comput.-Aided Design Inegr. Circuits Syst.,2018
3. Stress evolution due to electromigration in confined metal lines
4. V. Sukharev , A. Kteyan , F. N. Najm et al, "Experimental Validation of a Novel Methodology for Electromigration Assessment in On-chip Power Grids ", IEEE TCAD , 2021 . V. Sukharev, A. Kteyan, F.N. Najm et al, "Experimental Validation of a Novel Methodology for Electromigration Assessment in On-chip Power Grids", IEEE TCAD, 2021.
5. Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited)
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