Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects
Author:
Affiliation:
1. GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Wilschdorfer Landstr. 101, D-01109, Germany
2. Fraunhofer Institute for Nondestructive Testing (IZFP-D), Maria-Reiche-Str. 2, D-01109 Dresden, Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6523362/6531927/06531951.pdf?arnumber=6531951
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