Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters
Author:
Affiliation:
1. University of Minnesota,Department of Electrical and Computer Engineering,Minneapolis,USA
2. Nvidia,Santa Clara,CA,USA
3. Siemens EDA,Yerevan,Armenia
4. Siemens EDA,Santa Clara,CA,USA
Funder
Semiconductor Research Corporation (SRC)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10117589/10117581/10117811.pdf?arnumber=10117811
Reference12 articles.
1. Electromigration Effects in Power Grids Characterized from a 65 nm Test Chip;zhou;Transactions on Device and Materials Reliability (TDMR),2019
2. Electromigration Effects in Power Grids Characterized Using an On-Chip Test Structure with Poly Heaters and Voltage Tapping Points
3. Effect of thermal gradients on the electromigrationi life-time in power electronics;nguyen;IEEE International Reliability Physics Symposium (IRPS),2004
4. Experimental Validation of a Novel Methodology for Electromigration Assessment in On-chip Power Grids;sukharev;IEEE Trans on Computer-Aided Design of Integrated Circuits and Systems,2021
5. A 16nm All-Digital Hardware Monitor for Evaluating Electromigration Effects in Signal Interconnects Through Bit-Error-Rate Tracking
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