Inline Failure Analysis of Sintered Layers in Power Modules using Infrared Thermography-Reference-Cited by-同舟云学术

Inline Failure Analysis of Sintered Layers in Power Modules using Infrared Thermography

Published:2022-04-25 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
language:
Short-container-title:

Author:

Panahandeh S.¹,May D.¹,Grosse-Kockert C.¹,Stelzer A.²,Rabay B.²,Busse D.³,Wunderle B.⁴,Ras M. Abo¹

Affiliation:

1. Berliner Nanotest und Design GmbH,Berlin,Germany

2. Nano-Join GmbH,Berlin,Germany

3. Budatec GmbH,Berlin,Germany

4. Technische Universität Chemnitz,Chemnitz,Germany

Funder

Ministry of Education

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758907.pdf?arnumber=9758907

Reference12 articles.

1. Transient thermal analysis as failure analytical tool in electronic packaging

2. Acoustic Microscopy of Semiconductor Packages;hartfield;Microelectronics Failure Analysis Desk Reference,2011

3. Thermographic nondestructive evaluation of industrial materials and structures;cielo;Materials Evaluation,1987

4. Paving the way for the replacement of solder interconnections in power electronics by silver-sinter using pulsed infrared thermography

5. Transient thermal response as failure analytical tool-a comparison of different Powered by TCPDF (www.tcpdf.org) techniques;may;2013 14th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) IEEE,0

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Inline solution for characterization of chip substrate connections by Laser Speckle Photometry;2023 IEEE 14th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED);2023-08-28

2. Failure Analysis of Sintered Layers in Power Modules Using Laser Lock-in Thermography;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

3. Defect Detection of Solder Connection Layer in Power Electronic Components by Laser Speckle Photometry;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

4. Inline Tilt Measurements of Sintered Dies by Optical Line Scanning as Quality Assessment Tool for Smart Production;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25