Paving the way for the replacement of solder interconnections in power electronics by silver-sinter using pulsed infrared thermography-Reference-Cited by-同舟云学术

Paving the way for the replacement of solder interconnections in power electronics by silver-sinter using pulsed infrared thermography

Published:2019-09 Issue: Volume: Page:
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Container-title:2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
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Author:

Wargulski Dan R.¹,Rabay Battist²,Stelzer Adrian²,Rudzki Jacek³,Hindel Armin⁴,Bast Markus⁴,Busse Dirk⁵,Auerswald Ellen⁶,Ras Mohamad Abo¹

Affiliation:

1. Berliner Nanotest und Design GmbH,Berlin,Germany

2. Nano-Join GmbH,Berlin,Germany

3. Danfoss Silicon Power GmbH,Flensburg,Germany

4. Fachhochschule Kiel,Kiel,Germany

5. Budatec GmbH,Berlin,Germany

6. Fraunhofer Institut fur Elektronische Nanosysteme ENAS,Chemnitz,Germany

Publisher

IEEE

Link

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