Pulsed infrared thermal imaging as inline quality assessment tool-Reference-Cited by-同舟云学术

Pulsed infrared thermal imaging as inline quality assessment tool

Published:2023-03 Issue: Volume:142 Page:114910
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Panahandeh S.,May D.,Grosse-Kockert C.,Schacht R.,Ras M. Abo,Wunderle B.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Acoustic microscopy of semiconductor packages;Hartfield,2011

2. X-ray computed tomography for non-destructive failure analysis in microelectronics;Pacheco,2010

3. Detection and characterization of defects in microelectronic packages and boards by means of high-resolution X-ray computed tomography (CT);Pacheco,2011

4. Paving the way for the replacement of solder interconnections in power electronics by silver-sinter using pulsed infrared thermography;Wargulski,2019

5. Comparative die-attach failure analysis by thermoreflectance, infrared thermography and scanning acoustic microscopy;Wargulski,2018

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