Nano-Silver Pressureless Sintering Technology in Power Module Packaging-Reference-Cited by-同舟云学术

Nano-Silver Pressureless Sintering Technology in Power Module Packaging

Published:2022-08-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Conference on Mechatronics and Automation (ICMA)
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Author:

Gao Lilan¹,Tian Xinwei¹,Wu Chengjin¹,Xing Yulong²,Tan Yansong¹,Chen Xu³,Lu Guoquan⁴

Affiliation:

1. Tianjin University of Technology,Tianjin Key Laboratory for Advanced Mechatronic System Design and Intelligent Control,Tianjin,P. R. China,300384

2. Tianjin University f Technology,National Demonstration Center or Experimental Mechanical and Electrical Engineering Education,Tianjin,P. R. China,300384

3. Tianjin University,School of Chemical Engineering,Tianjin,PR of China,300350

4. Virginia Polytechnic Institute and State University,School of Materials Science and Engineering,Blacksburg,Virginia,USA,24061

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9855896/9855897/09856054.pdf?arnumber=9856054

Reference19 articles.

1. Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

2. Rapid sintering of nano-Ag paste at low current to bond large area (>100mm2) power chips for electronics packaging;xie;Journal of Materials Processing Technology,2016

3. Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment

4. Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging

5. High thermal conductivity diamond-doped silver paste for power electronics packaging

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