Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment-Reference-Cited by-同舟云学术

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Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment

Published:2022-03 Issue: Volume:13 Page:100124
ISSN:2590-1508
Container-title:Materials Letters: X
language:en
Short-container-title:Materials Letters: X

Author:

Luo Ruidong,Yu Xiaoli,Wu Zhen,Zhang Hao,Liu Zhi-Quan,Suganuma Katsuaki,Li Cai-Fu

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference26 articles.

1. Tribological and mechanical properties of AA6061 reinforced with SiC and graphite for automobile applications

2. Preparation of C/C–SiC composite by low temperature compression molding–liquid silicon infiltration and its application in automobile brake

3. Corrosion behavior of Sn-based lead-free solder alloys: a review

4. Effects of impurities on double twinning nucleation and grain refinement of Sn-based solder joints

5. Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability;IEEE Transactions on Power Electronics;2024-09

2. High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling;Journal of Materials Research and Technology;2023-09

3. Nano-Silver Pressureless Sintering Technology in Power Module Packaging;2022 IEEE International Conference on Mechatronics and Automation (ICMA);2022-08-07

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