High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling-Reference-Cited by-同舟云学术

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Published:2023-09 Issue: Volume:26 Page:3183-3200
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Hu Dong^ORCID,Qian Cheng,Liu Xu,Du Leiming,Sun Zhongchao,Fan Xuejun,Zhang Guoqi,Fan Jiajie^ORCID

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

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5. Recent progress in rapid sintering of nanosilver for electronics applications;Liu;Micromachines,2018

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