Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds-Reference-Cited by-同舟云学术

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Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds

Published:2024-03 Issue: Volume:154 Page:115327
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Gharaibeh Mohammad A.,Wilde Jürgen

Funder

Deutscher Akademischer Austauschdienst

Deutscher Akademischer Austauschdienst France

Publisher

Elsevier BV

Reference44 articles.

1. Influence of microscale tin particles on mechanical properties of silver sintering joints with reduced processing parameters;Hadeler,2023

2. Transient liquid phase bonding;Gale;Sci. Technol. Weld. Join.,2004

3. Transient liquid phase bonding using AgSn-alloys for stress reduced sensor mounting;Feißt,2018

4. Effect of process and service conditions on TLP-bonded components with (Ag, Ni–) Sn interlayer combinations;Lis;J. Electron. Mater.,2015

5. A review: formation of voids in solder joint during the transient liquid phase bonding process-causes and solutions;Mokhtari;Microelectron. Reliab.,2019

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