Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications-Reference-Cited by-同舟云学术

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Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Published:2018-07-10 Issue:7 Volume:9 Page:346
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Liu Wei,An Rong,Wang Chunqing,Zheng Zhen,Tian Yanhong,Xu Ronglin,Wang Zhongtao

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Link

http://www.mdpi.com/2072-666X/9/7/346/pdf

Reference170 articles.

1. Mechanical properties of nano-silver joints as die attach materials

2. Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

3. Effects of Die-Attach Material and Ambient Temperature on Properties of High-Power COB Blue LED Module

4. Wada bifurcations and partially Wada basin boundaries in a two-dimensional cubic map

5. Thermal characteristic of sintered Ag–Cu nanopaste for high-temperature die-attach application

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4. Effect of the paste spreadability on ultrasonic transducer fabricated by pressureless sintering of nano-Ag;Measurement;2024-08

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