Inline solution for characterization of chip substrate connections by Laser Speckle Photometry
Author:
Affiliation:
1. Fraunhofer Institute for Ceramic Technologies and Systems IKTS,Testing of Electronics and Optical Methods,Dresden,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10271381/10271407/10271458.pdf?arnumber=10271458
Reference21 articles.
1. Laser speckle movement caused by surface deformation and light wavelength change;wu;Acta Mechanica Sinica,1991
2. Evaluation of fatigue damage by analyzing the scale properties of NDE signals;cikalova;14th International Symposium on Nondestructive Characterization of Materials,2013
3. Defect detection during laser welding by laser speckle photometry
4. Macro‐ to Microscale Heat Transfer
5. Display of local activity using dynamical speckle patterns
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