Defect Detection of Solder Connection Layer in Power Electronic Components by Laser Speckle Photometry-Reference-Cited by-同舟云学术

Defect Detection of Solder Connection Layer in Power Electronic Components by Laser Speckle Photometry

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
language:
Short-container-title:

Author:

Chen Lili¹,Cikalova Ulana²,Bendjus Beatrice¹

Affiliation:

1. Testing of Electronics and Optical Methods Fraunhofer Institute for Ceramic Technologies and Systems IKTS,Dresden,Germany

2. Condition Monitoring and Test Services Fraunhofer Institute for Ceramic Technologies and Systems IKTS,Dresden,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939513.pdf?arnumber=9939513

Reference22 articles.

1. Holographic Interferometry (HI), Active Infrared Thermography (IRT) and Ultrasound Testing (UT) for the nondestructive assessment of esteemed hand-painted ceramic sample panels;sfarra;in 6th International Workshop NDT in progress 2011,2011

2. Dynamic Laser Speckle and Applications

3. Evaluation of fatigue damage by analyzing the scale properties of NDE signals;cikalova;13th International Symposium on Nondestruc-tive Characterization of Materials,0

4. Laser speckle movement caused by surface deformation and light wavelength change;wu;Acta Mechanica Sinica,1991

5. Macro‐ to Microscale Heat Transfer

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Inline solution for characterization of chip substrate connections by Laser Speckle Photometry;2023 IEEE 14th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED);2023-08-28