Failure Analysis of Sintered Layers in Power Modules Using Laser Lock-in Thermography
Author:
Affiliation:
1. Berliner Nanotest und Design GmbH,Berlin,Germany
2. Technische Universität Chemnitz,Chemnitz,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100762.pdf?arnumber=10100762
Reference17 articles.
1. Hochempfindliche lock-in thermographie zur abbildung von ?Wwärmequellen;breitenstein,2002
2. Localization of weak heat sources in electronic devices using highly sensitive lock-in thermography
3. Fault Localization and Functional Testing of ICs by Lock-in Thermography
4. Thermal wave reflection and refraction: Theoretical and experimental evidence
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