Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Complete avalanche process and failure mechanism of trench-gate FS-IGBT under unclamped inductive switching by using infrared visualization method;Tong;IEEE Trans. Electron. Dev.,2020
2. Thermal imaging for reliability characterization of copper vias;Alavi,2011
3. Failure analysis of sintered layers in power modules using laser lock-in thermography;Panahandeh,2023
4. A temperature dependent lumped-charge model for trench FS-IGBT;Duan,2018
5. Lifting-off of Al bonding wires in IGBT modules under power cycling: failure mechanism and lifetime model;Huang;IEEE J. Emerging and Selected Topics in Power Electr.,2020