Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference10 articles.
1. Board-level reliability of Pb-free solder joints of TSOP and various CSPs
2. A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density
3. Current-induced marker motion in gold wires
4. Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization
5. A comparison between normally and highly accelerated electromigration tests
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Vacuum-controlled wafer-level packaging for micromechanical devices;Japanese Journal of Applied Physics;2014-05-02
2. High-sensitivity electromigration testing of lead-free WLCSP solder bumps;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010
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