Vacuum-controlled wafer-level packaging for micromechanical devices
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/53/i=6/a=066501/pdf
Reference18 articles.
1. Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress
2. Wafer-Level Packaging for Micro-Electro-Mechanical Systems Using Surface Activated Bonding
3. Wafer level packaging of MEMS
4. Design, fabrication and testing of wafer-level thin film vacuum packages for MEMS based on nanoporous alumina membranes
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2. Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022
3. Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15
4. Shorting out bonding method for multi-stack anodic bonding and its application in wafer-level packaging;Modern Physics Letters B;2020-08-12
5. Effect of Environment on Activation and Sorption of Getter Alloys and Multilayers for Hybrid Wafer-level Vacuum Packaging;Sensors and Materials;2019-09-20
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