Author:
Foley S.,Scorzoni A.,Balboni R.,Impronta M.,De Munari I.,Mathewson A.,Fantini F.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Electromigration in thin-film interconnection lines: models, methods and results
2. Proc. IEEE International Reliability Physics Symposium;Root,1985
3. A new wafer‐level isothermal Joule‐heated electromigration test for rapid testing of integrated‐circuit interconnect
4. Proc. IEEE International Reliability Physics Symposium;Pierce,1994
5. Proc. IEEE Int. Conf of Microelectronics Test Structures;Giroux,1995
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献