Electromigration in thin-film interconnection lines: models, methods and results-Reference-Cited by-同舟云学术

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Electromigration in thin-film interconnection lines: models, methods and results

Published:1991-12 Issue:4-5 Volume:7 Page:143-220
ISSN:0920-2307
Container-title:Materials Science Reports
language:en
Short-container-title:Materials Science Reports

Author:

Scorzoni Andrea,Neri Bruno,Caprile Candida,Fantini Fausto

Publisher

Elsevier BV

Subject

General Engineering

Reference242 articles.

1. Thin Films: Interdiffusion and Reactions;d'Heurle,1978

2. Affidabilità e Fisica dei Meccanismi di Guasto dei Semiconduttori;Bobbio,1980

3. Reliability and Yield in MOS VLSI Technology;Fantini,1989

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