1. Xuan, X. (2004). Analysis and Design of Reliable Mixed-Signal CMOS Circuits. [Ph.D. Thesis, Georgia Institute of Technology, Department of Electrical and Computer Engineering].
2. Lienig, J., and Jerke, G. (2005, January 3–7). Embedded Tutorial: Electromigration-Aware Physical Design of Integrated Circuits. Proceedings of the 18th International Conference on VLSI Design Held Jointly with 4th International Conference on Embedded Systems Design, Kolkata, India.
3. Lienig, J. (2006, January 9–12). Introduction to electromigration-aware physical design. Proceedings of the International Symposium on Physical Design (ISPD’06), New York, NY, USA.
4. Maiz, J.A. (1989, January 11–13). Characterization of electromigration under bidirectional (BC) and pulsed unidirectional (PDC) currents. Proceedings of the 27th Annual Proceedings., International Reliability Physics Symposium, Phoenix, AZ, USA.
5. Jonggook, K., Tyree, V.C., and Crowell, C.R. (1999, January 18–21). Temperature gradient effects in electromigration using an extended transition probability model and temperature gradient free tests. I. Transition probability model. Proceedings of the 1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460), Lake Tahoe, CA, USA.