A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density-Reference-Cited by-同舟云学术

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A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density

Published:2004-09 Issue:3 Volume:27 Page:472-479
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:en
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Lee T.-Y.T.,Lee T.-Y.,Tu K.-N.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/29407/01331542.pdf?arnumber=1331542

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solder joint inspection using eigensolder features;Soldering & Surface Mount Technology;2018-09-03

2. Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball;2010 11th International Conference on Electronic Packaging Technology & High Density Packaging;2010-08

3. Electromigration Characteristic of SnAg$_{3.0}$Cu$_{0.5}$ Flip Chip Interconnection;IEEE Transactions on Advanced Packaging;2010-02

4. Elucidating the Effects of Current Stress History on Reliability Characteristics by Dynamic Analysis;Japanese Journal of Applied Physics;2008-10-17

5. Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress;Japanese Journal of Applied Physics;2008-02-15

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