Enhanced Metalorganic Chemical Vapor Deposition Titanium Nitride Film Fabricated Using Tetrakis-Dimethylamino-Titanium for Barrier Metal Application in Sub-Half-Micron Technology-Reference-Cited by-同舟云学术

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Enhanced Metalorganic Chemical Vapor Deposition Titanium Nitride Film Fabricated Using Tetrakis-Dimethylamino-Titanium for Barrier Metal Application in Sub-Half-Micron Technology

Published:1996-08-15 Issue:Part 1, No. 8 Volume:35 Page:4274-4279
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Wang Chin-Kun,Liu Lu-Min,Liao Marvin,Cheng Huang-Chung,Lin Mou-Shiung

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on plasma assisted metal-organic chemical vapor deposition of Zr(C,N) and Ti(C,N) thin films andin situplasma diagnostics with optical emission spectroscopy;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2008-07

2. Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes;Journal of The Electrochemical Society;2005

3. Growth of Hf(C,N) thin films on Si(100) and D2 steel substrates by plasma assisted MOCVD;Surface and Coatings Technology;2000-09

4. Effects of Barrier-Metal Schemes of Tungsten Plugs and Blanket Film Deposition;Japanese Journal of Applied Physics;2000-08-15

5. Adsorption and desorption kinetics of tetrakis(dimethylamino)titanium and dimethylamine on TiN surfaces;Applied Surface Science;1999-01

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