Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference50 articles.
1. Chemical Vapor Deposition of TiN for Sub-0.5 μm ULSI Circuits
2. D.K. Ferry, M.N. Kozicki, G.B. Raupp, Some Fundamentals Issues on Metallization in VLSI, SPIE, San Jose, CA, 1991, p. 2.
3. S.P. Murarka, Metallization: Theory and Practice for VLSI and ULSI, Butterworth-Heinemann, Boston, 1993.
4. Collimated sputtering of TiN/Ti liners into sub‐half‐micrometer high aspect ratio contacts/lines
5. Surface spectroscopic studies of the deposition of TiN thin films from tetrakis‐(dimethylamido)‐titanium and ammonia
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