Effects of Barrier-Metal Schemes of Tungsten Plugs and Blanket Film Deposition
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation of Static Corrosion Between W Metals and TiN[sub x] Barriers in a W Chemical-Mechanical-Polishing Slurry;Journal of The Electrochemical Society;2008
2. Study of metal organic chemical vapor deposition TiN thin films in real structures;Thin Solid Films;2006-12
3. Physical and Electrical Characteristics of Physical Vapor-Deposited Tungsten for Bit Line Process;Japanese Journal of Applied Physics;2004-12-09
4. PECVD-Ti/TiN[sub x] Barrier with Multilayered Amorphous Structure and High Thermal Stability for Copper Metallization;Electrochemical and Solid-State Letters;2003
5. Study on the effect of plasma treatment on TiN films in N2/H2 atmosphere using x-ray reflectivity and secondary ion mass spectroscopy;Applied Physics Letters;2002-01-21
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