Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process-Reference-Cited by-同舟云学术

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Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process

Published:2011-05-20 Issue:5 Volume:50 Page:05EC02
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Jiao Yubo,Sampurno Yasa Adi,Zhuang Yun,Wei Xiaomin,Meled Anand,Philipossian Ara

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference6 articles.

1. Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

2. A Method for Direct Measurement of Substrate Temperature during Copper CMP

3. Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical Planarization

4. Arrhenius Characterization of ILD and Copper CMP Processes

5. Analysis of Pads with Slanted Grooves for Copper CMP

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Hydrogen Peroxide on Chemical Mechanical Polishing of Copper Surface: Exploration of Reaction Pathways with Molecular Dynamics Simulation and Activation Energies Calculation;Tribology Online;2024-05-15

2. Determining instantaneous removal rates in metal chemical mechanical planarization;Japanese Journal of Applied Physics;2020-05-20

3. Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process;ECS Journal of Solid State Science and Technology;2019

4. Application of a Slurry Injection System to Cobalt “Buff Step” Chemical Mechanical Planarization;ECS Journal of Solid State Science and Technology;2018

5. Cobalt “Buff Step” Chemical Mechanical Planarization;ECS Journal of Solid State Science and Technology;2018

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