Analysis of Pads with Slanted Grooves for Copper CMP-Reference-Cited by-同舟云学术

Analysis of Pads with Slanted Grooves for Copper CMP

Published:2008 Issue:10 Volume:155 Page:H750
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Rosales-Yeomans D.,DeNardis D.,Borucki L.,Suzuki T.,Philipossian A.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. M. R. Oliver ,Chemical-Mechanical Planarization of Semiconductors, Springer, New York (2004).

2. G. P. Muldowney , in10th International CMP Symposium, Lake Placid, NY (2005).

3. D. DeNardis , Ph.D. Thesis, Department of Chemical and Environmental Engineering, University of Arizona (2006).

4. G. P. Muldowney , inCMP-MIC Conference Proceedings, Marina del Rey, CA (2005).

5. Z. Li , Ph.D. Thesis, Department of Chemical and Environmental Engineering, University of Arizona (2005).

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Material removal and tool path ripple error of bonnet polishing using pads with different groove patterns;The International Journal of Advanced Manufacturing Technology;2024-05-08

2. Slurry Supply Mechanism Utilizing Capillary Effect in Chemical Mechanical Planarization;ECS Journal of Solid State Science and Technology;2019

3. Fractional In Situ Pad Conditioning in Chemical Mechanical Planarization;Tribology Letters;2016-12-24

4. Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP;Microelectronic Engineering;2016-05

5. Polishing Characteristics of Hydrophilic Pad in Chemical Mechanical Polishing Process;Materials and Manufacturing Processes;2012-06