Slurry Supply Mechanism Utilizing Capillary Effect in Chemical Mechanical Planarization
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Von Mises Stress in Chemical‐Mechanical Polishing Processes
2. Pressure Distribution Control on Surface Conformable Polishing in Chemical Mechanical Planarization
3. Fine Adjustment of Pressure Distribution on Surface Conformable Polishing in Chemical Mechanical Planarization
4. Three-dimensional wafer-scale copper chemical–mechanical planarization model
5. Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing
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1. Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization;Lubricants;2024-02-19
2. ILD CMP Polishing Pad and Disk Characterization;2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2022-05-02
3. Study on the effect of residual ceria slurry on chemical mechanical planarization (CMP);Microelectronic Engineering;2021-09
4. Hybrid CMP Slurry Supply System Using Ionization and Atomization;Applied Sciences;2021-03-03
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