Polishing Characteristics of Hydrophilic Pad in Chemical Mechanical Polishing Process
Author:
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1080/10426914.2011.602785
Reference25 articles.
1. Effects of pad properties on material removal in chemical mechanical polishing
2. Influence of a Retaining Ring on Strain and Stress in the Chemical Mechanical Polishing Process
3. Analysis of Pads with Slanted Grooves for Copper CMP
4. Proposal of New Polishing Technology without Using a Polishing Pad
5. Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing
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