Effect of Various CVD-Coated Conditioning Disc Designs and Polisher Kinematics on Fluid Flow Characteristics during CMP-Reference-Cited by-同舟云学术

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Effect of Various CVD-Coated Conditioning Disc Designs and Polisher Kinematics on Fluid Flow Characteristics during CMP

Published:2020-01-21 Issue:2 Volume:9 Page:024005
ISSN:2162-8777
Container-title:ECS Journal of Solid State Science and Technology
language:
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Mariscal Juan Cristobal,Sampurno Yasa,Slutz Dave,Philipossian Ara

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/2162-8777/ab6830/pdf

Reference40 articles.

1. Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

2. Effect of Slurry Injection Position on Slurry Mixing, Friction, Removal Rate, and Temperature in Copper CMP

3. (Invited) Comparison of Slurry Film Distribution between a Novel Slurry Injection System and Conventional Slurry Application Method

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effective Particle Analysis on Wafer in the EKF-CMP System;ECS Journal of Solid State Science and Technology;2021-02-01

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