Proposal of New Polishing Technology without Using a Polishing Pad
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference5 articles.
1. Chemical-Mechanical Polishing in Semidirect Contact Mode;Bhushan;J. Electrochem. Soc.,1995
2. Emerging Development in CMP for semiconductor planarization;Fury;Solid State Technology,1995
3. Hydrodynamics of a Chemical-Mechanical Planarization Process;Sohn;Materials Research Society Symposium Proceedings,2000
4. Chemical mechanical polishing with fixed abrasives using different subpads to optimise wafer uniformity;Velden;Microelectronic Engineering,2000
5. The effect of Pad Wear on the Chemical Mechanical Polishing of Silicon Wafers;Byrne;Annals of the CIRP,1999
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2. Review on polishing technology of small-scale aspheric optics;The International Journal of Advanced Manufacturing Technology;2021-06-17
3. Abrasive fine-finishing technology;CIRP Annals;2016
4. Modeling of “Pad-in-a-Bottle”: A Novel Planarization Process Using Suspended Polymer Beads;MRS Proceedings;2013
5. Polishing Characteristics of Hydrophilic Pad in Chemical Mechanical Polishing Process;Materials and Manufacturing Processes;2012-06
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