Author:
Sohn In-Sung,Moudgil Brij,Singh Rajiv,Park C.-W.
Abstract
The flow of a slurry in a CMP process has been investigated. This wafer-scale model provides the three dimensional flow field of the slurry, the spatial distribution of the local shear rate imposed on the wafer surface, and the streamline patterns which reflect the transport characteristics of the slurry.
Publisher
Springer Science and Business Media LLC
Cited by
4 articles.
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